The advantages of surface mount technology include: high assembly density, reducing the size of the circuit board; good anti-interference, reducing the distribution parameters; high-speed signal transmission, due to the compact structure, short connecting lines; simplify the production process, reduce production costs, and facilitate the automation of production; high efficiency and high reliability, suitable for automated production and improve the yield of electronic products.

Dual In-line Package, or DIP, is a type of integrated circuit package that is used to connect a printed circuit board (PCB) to the components inside the circuit. DIP is a versatile and easy to use package that can be used for a wide range of applications, including data processing, communications, and control systems.